http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101397950-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-281 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1067 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0373 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D179-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-285 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1085 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36 |
| filingDate | 2012-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2014-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2014-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101397950-B1 |
| titleOfInvention | COMPOSITION FOR FLEXIBLE PRINTED CIRCUIT BOARD COVERAGE |
| abstract | A composition for use in a cover coat excellent in heat resistance, flexibility and electrical characteristics, a method for producing the same, and a method for forming such a coverlay on a printed circuit board. The coverlay composition of the present invention has the following constitution. 0.01 to 5.0 wt% of polyimide, 0.01 to 5.0 wt% of antifoaming agent, 0.01 to 5.0 wt% of leveling agent, 0.01 to 5.0 wt% of dispersant, 0.1 to 15.0 wt% of modified polyimide, and 1.0 to 15.0 wt% of silica. A step of first polymerizing the amine in a reaction solvent; A step of subjecting the acid anhydride to a secondary polymerization in a separate reaction solvent; Mixing the product by the first polymerization and the product by the second polymerization to form a polyamic acid; And forming a mixture of the polyamic acid and a defoaming agent, a leveling agent, a dispersant, and a modified polyimide. Preparing a mask having a desired print pattern on a circuit of a flexible printed circuit board using the coverlay composition; Applying a polyimide composition to an opening of the mask; And a step of curing the printed circuit board to which the composition has been applied. The present invention also provides a method of forming a polyimide coverlay on a flexible printed circuit board. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20200080612-A |
| priorityDate | 2012-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 54.