| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12043
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29393
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-2939
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29355
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29391
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-2929
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29386
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29347
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29344
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29339
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29291
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83101 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-504
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-50 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48 |
| filingDate |
2011-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2014-05-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2014-05-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-101395707-B1 |
| titleOfInvention |
Adhesive film for semiconductor |
| abstract |
The present invention relates to an adhesive film for semiconductor which contains an amine curing agent and a phenol curing agent together, and relates to an adhesive film excellent in void characteristics and reliability properties. More specifically, the present invention relates to a semiconductor-use adhesive film having a ratio of storage elastic modulus before curing to that after 80% curing of 1.5 to 3.0 and having a large rate of change thereof. The adhesive film for semiconductor has flexible properties during die bonding to reduce voids, Is easily formed to control the void area on the bonding interface and has a hard physical property after curing to provide excellent shear strength and bottom flowability and good reliability properties. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101936593-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101936217-B1 |
| priorityDate |
2011-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |