| abstract |
The chip capacitor 20 is disposed in the core substrate 30 of the printed wiring board 10. As a result, the distance between the IC chip 90 and the chip capacitor 20 becomes short, and the loop inductance can be reduced. Since the first resin substrate 30a, the second resin substrate 30b, and the third resin substrate 30c are laminated, sufficient strength can be obtained for the core substrate 30. |