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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B82B3-00
filingDate 2012-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2014-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3f01991f714001a0082ba4fa91f1aaa0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_98e41eb4d7b5fff41d7a4f5a003e87ac
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publicationDate 2014-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-101367187-B1
titleOfInvention Manufacturing Method of Copper Oxide for Printed Circuit Board
abstract The method for manufacturing copper oxide for a printed circuit board according to the present invention is a method for manufacturing copper oxide (CuO) for a printed circuit board, which has 99% or more purity of copper (mole), ammonia water (NH 4 OH) 3 to 5 mole, And a dissolving step of preparing a solution in which the copper is dissolved by mixing and stirring the mixture so as to have a ratio of 1 to 3 mole of ammonium carbonate ((NH 4 ) 2 CO 3 ); A first filtering step performed after the dissolution step to remove insoluble components generated in the solution generated in the dissolution step; Adding copper ammonium to the solution filtered in the first filtering step to prepare copper carbonate by heating to 30 ° C. to 100 ° C. to remove ammonia by supplementing CO 2 components; A second filtering step performed after the copper carbonate manufacturing step to prepare copper carbonate in the form of a wet cake by separating the generated copper carbonate and the solution; And a copper oxide manufacturing step of manufacturing copper oxide (CuO) by heating the wet cake type copper carbonate to an electric furnace at 300 ° C. to 800 ° C. after the second filtering step.
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priorityDate 2012-11-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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