http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101365662-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23G1-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23G1-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-1623 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-32 |
| filingDate | 2011-10-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2014-02-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2014-02-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101365662-B1 |
| titleOfInvention | Electroless nickel-phosphorus plating method |
| abstract | The present invention relates to an electroless Ni-P plating method. The present invention comprises a pretreatment step of degreasing, etching, dismuting and under galvanizing a subject; And electroless plating on the pretreated subject by using an electroless plating solution, during the electroless plating, immersing a stainless steel rod in the plating liquid, and then using the stainless steel rod as a cathode and the plating bath as an anode. The present invention provides an electroless Ni-P plating method for plating while applying current to the stainless rod and the plating bath. According to the present invention, the use time of the plating liquid can be extended, thereby reducing the plating cost and reducing the amount of waste liquid. |
| priorityDate | 2011-10-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 58.