http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101362543-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-0008 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2367-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02W30-62 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L67-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0045 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-67 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-032 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D167-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J11-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-0008 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F299-022 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G18-67 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L67-06 |
| filingDate | 2010-05-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2014-02-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2014-02-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101362543-B1 |
| titleOfInvention | Photosensitive resin composition, its dry film, and hardened | cured material, and printed wiring board using these |
| abstract | Alkali-developable photosensitive resin composition contains (A) resin which uses recovered polyester as a raw material, and (B) photoinitiator. Preferably, the resin (A) is a polyol, a carboxyl group-containing resin or a photosensitive resin having an ethylenically unsaturated group, and in particular, a polyol obtained by depolymerizing the recovered polyester (a) with two or more polyols (b) in one molecule, or It is a carboxyl group-containing resin obtained by making a polybasic acid or its anhydride (c) react before, simultaneously, or after depolymerization, and it is preferable to further contain carboxyl group-containing photosensitive resin (C) other than the said resin (A). Preferably, the photosensitive resin composition further contains a thermosetting component (D) or further contains a coloring agent (E). The said photosensitive resin composition or its dry film can be advantageously applied to formation of the cured film, such as a soldering resist of a printed wiring board or a flexible printed wiring board. |
| priorityDate | 2009-05-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 659.