http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101352509-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02B5-3016 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D3-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-426 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0274 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02B5-3016 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D3-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 |
| filingDate | 2012-05-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2014-01-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2014-01-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101352509-B1 |
| titleOfInvention | Thinner composition |
| abstract | BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thinner composition, and more particularly, to effectively remove photoresist that is unnecessarily attached to an edge and a rear surface of a wafer used in semiconductor manufacturing in a short time, and to a photoresist RRC ( Reisist Reduce Coating) It can reduce the use of photoresist by improving the performance, high stability to human body, can be applied to various processes by reducing the step of interface, and can improve the production yield economically by simplifying the semiconductor manufacturing process. It relates to a thinner composition. |
| priorityDate | 2012-05-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 34.