| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L27-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G2110-0066 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24D13-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L75-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-222
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-10 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24D13-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-04 |
| filingDate |
2010-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2014-01-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2014-01-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-101352235-B1 |
| titleOfInvention |
Polishing pads, polyurethane layers therefor, and methods of polishing silicon wafers |
| abstract |
A polyurethane layer is described for forming a polishing pad for a semiconductor wafer, including a foamed polyurethane, wherein the polyurethane foam has a density of about 640 to about 960 kg / m 3 and an average diameter of about 20 to about 200 It has a large number of cells that are μm and has particles of hydrophobic polymer having a critical surface energy of less than 35 mN / m and a median particle size of 3 to 100 μm. Polishing pads are also described, as well as methods for polishing. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11628535-B2 |
| priorityDate |
2009-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |