| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49126
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49128
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-4913
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49155 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1214
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-84
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-78603
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1266 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-84 |
| filingDate |
2007-10-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2014-01-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2014-01-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-101351213-B1 |
| titleOfInvention |
A metal substrate having an electronic device formed thereon |
| abstract |
The inventive method of forming an electronic device 70 on a metal substrate 10 deposits a first seed layer 40 of a first metal on one or more master surfaces 30 with roughness less than 400 nm. The support metal layer 60 is bonded to the first seed layer 40 to form the metal substrate 10. The metal substrate 10 is removed from the master surface 30 and one or more electronic devices 70 are formed on the seed layer 40 of the metal substrate 10. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I751293-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018159978-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11089691-B2 |
| priorityDate |
2006-10-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |