http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101348424-B1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_cd9bc603043b5ff38c4b5524ee454c60 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2834 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-07314 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2886 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R3-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R1-067 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-66 |
| filingDate | 2013-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2014-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3324b6cfda6f48aebc55e7036b6b8a3f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_12f817444144277e54b426c3a4296b8b |
| publicationDate | 2014-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101348424-B1 |
| titleOfInvention | Pogo Block for High Fix Board of Automatic Test Equipment and Manufacturing Method Thereof |
| abstract | The present invention relates to a pogo block for a high-fix board of an automatic test apparatus, and more particularly, (1) drilling a plurality of through holes to be formed in a printed circuit board; (2) filling the through holes of the printed circuit board with metal; (3) back-drilling a predetermined depth and diameter in each of the through hole forming portions of the lower surface of the printed circuit board; And (4) characterized in that it comprises the step of pressing the pogo pin provided at one end of the pogo cable in the hole formed by the back-drilling process of step (3). According to the pogo block for a high-fix board of the automatic test apparatus proposed by the present invention and a method for manufacturing the same, a through hole is drilled in a printed circuit board using a HLP (Hole Pluging LAND) method, and the metal is loaded in the entire hole. After the fabrication, the pogo block is manufactured by back-drilling the pogo pin to be crimped into the lower surface of the printed circuit board, thereby making it possible to construct a pogo block having a high density. Compared with the solder method, it can save time and manpower significantly, and it is easy to repair after manufacturing, and the SI route is improved by shortening the signal route connected with the interposer as much as possible. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11564110-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11563492-B2 |
| priorityDate | 2013-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23985 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID482532689 |
Total number of triples: 22.