http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101344018-B1
Outgoing Links
Predicate | Object |
---|---|
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-48 |
filingDate | 2007-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2013-12-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2013-12-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | KR-101344018-B1 |
titleOfInvention | Non-cyanide electrolytic gold plating bath for gold bump or gold wiring formation |
abstract | BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-cyanide electrolytic gold plating bath which forms a gold bump or a gold wiring as an electrode of a semiconductor chip. This plating bath eliminates the irregularities of the surface caused by the step of the passivation layer, thereby forming a gold plating film which can obtain a sufficient bonding strength for mounting the semiconductor chip on the substrate.n n n In the non-cyanide electrolytic gold plating bath of the present invention, 1 to 20 g / L of gold sulfite alkali salt or gold of ammonium sulfite as gold, 1 to 30 g / L of water-soluble amine, thallium (Tl) compound, lead (Pb) compound, or arsenic (as) compound as a metal concentration of 0.1 ~ 100 mg / L, sulfites the SO 3 2 - both as a 5 ~ 100 g / L, the sulfate SO 4 2 - both as 1 ~ 120 g / L, the buffer 0.1 It is a non-cyanide electrolytic gold plating bath for gold bump or gold wiring formation which contains 0.1-100 mg / L as metal concentration at -30 g / L, and at least 1 sort (s) chosen from a palladium salt, a platinum salt, a zinc salt, and a silver salt. .n n n n Gold Bump, Gold Wiring, Non-Cyanide Gold Plating Bath, Passivation Film |
priorityDate | 2006-11-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 62.