http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101333966-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B57-02 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02 |
| filingDate | 2011-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2013-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101333966-B1 |
| titleOfInvention | High Efficiency Regeneration Method and Regeneration System of Cutting Fluid in Wafer Slurry for Semiconductor and Solar Cell Using Membrane Process |
| abstract | The present invention relates to a high efficiency regeneration method and a regeneration system of cutting fluid in waste slurries generated during the manufacture of wafers for semiconductor and solar cells using a membrane process. More specifically, in the process of regeneration of the cutting fluid in the waste sludge generated during the cutting of wafer materials in the form of silicon ingots for semiconductors and solar cells, first, by using a high-speed centrifugation process, the primary After the particles are removed, the microparticles in the waste cutting oil, which is the filtrate from which the large particles are removed, are effectively and stably separated by using a high-efficiency filtration process including a membrane regeneration process without adding any additives (water or chemicals). In addition, when the cutting fluid is regenerated, the water control & removal process in the filtration process is included, and the advanced dehydration process is subsequently applied, thereby improving the regeneration efficiency and increasing the purity of the reclaimed cutting fluid. And a playback system. According to the present invention, no additives (including water or solvent) are added, compared to the conventional method of refining cutting fluid in waste sludge, and a stable supply of high purity regenerated cutting fluid is achieved by applying a durable and durable membrane suitable for high viscosity and high concentration. The service life of the recycled sludge can be extended. As a result, the reduction of new cutting fluids used in the wafer manufacturing process for solar cells, as well as the reuse of recycled cutting fluids, can reduce not only the amount of waste sludge, which is an existing special industrial waste, but also the processing cost, thereby lowering the cost of manufacturing solar wafers. Gives |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104046504-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105062594-A |
| priorityDate | 2011-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 44.