http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101333706-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0045 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0226 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-039 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0236 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0233 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0392 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-039 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-075 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-016 |
| filingDate | 2009-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2013-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101333706-B1 |
| titleOfInvention | Positive photosensitive resin composition |
| abstract | The present invention relates to a positive photosensitive resin composition, wherein the positive photosensitive resin composition includes (A) a repeating unit represented by the following formula (1) or a repeating unit of the following formulas (1) and (2), and at least one terminal Polybenzoxazole precursors having a thermopolymerizable functional group derived from a mono amine compound having a carbon-carbon double bond in a portion thereof; (B) a photosensitive diazoquinone compound; (C) a silane compound; (D) a phenol compound; And (E) a solvent.n n n [Formula 1]n n n n n n n n (2)n n n n n n n n In Formulas 1 and 2, the definition of each substituent is as described in the specification.n n n The positive photosensitive resin composition of this invention contains the low temperature reactive thermosetting functional group which thermosets at 250-300 degreeC in the terminal of a polybenzoxazole precursor. Thus, the cured photosensitive resin composition provides improved mechanical properties, and has excellent sensitivity and resolution and a good pattern shape.n n n Positive type, photosensitive polybenzoxazole precursor composition, dissolution regulator, alkali aqueous solution, semiconductor device, low temperature curing |
| priorityDate | 2008-12-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 173.