http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101333515-B1

Outgoing Links

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classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-673
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B65D85-86
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-673
filingDate 2011-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2013-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2013-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-101333515-B1
titleOfInvention Carrier structure for ultra-thin substrate manufacturing
abstract The present invention relates to a carrier structure used in transportation and processing of a copper foil or a semiconductor substrate intermediate in an ultra-thin substrate manufacturing process. More particularly, the present invention relates to a first adhesive containing rubber- A releasing pressure sensitive adhesive prepared by adding a curing agent and a foaming agent to a mixed resin obtained by mixing a pressure-sensitive adhesive and a second pressure-sensitive adhesive, and a base film on which the foam releasing pressure-sensitive adhesive is applied, It is possible to provide a semiconductor substrate manufacturer with an opportunity to mass-produce a high-value-added ultra-thin semiconductor substrate by using existing equipment, as a result of satisfying the above-mentioned required performance condition in terms of strength, Semiconductor substrate manufacturers' cost competitiveness has been raised, For producing an ultra-thin substrate to have a significant ripple effect in the product it relates to a carrier structure.
priorityDate 2011-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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