http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101332430-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2312-04 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-01 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-17 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-375 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-3445 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-375 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 2009-12-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-11-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2013-11-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101332430-B1 |
| titleOfInvention | Epoxy resin composition for semiconductor device sealing and semiconductor device package using the same |
| abstract | The present invention relates to an epoxy resin composition for sealing semiconductor elements, and the epoxy resin composition according to the present invention includes an epoxy resin, a curing agent, a curing accelerator, an inorganic filler, and an additive capable of improving mold release properties. When sealing the semiconductor device with the epoxy resin composition of the present invention can improve the crack resistance and contamination resistance as well as the releasability can provide a semiconductor device package excellent in reliability.n n n n Semiconductor, Device, Sealed, Epoxy, Release |
| priorityDate | 2009-12-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 56.