http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101331573-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-028 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F283-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L101-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L77-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L69-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L69-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-028 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F283-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-02 |
| filingDate | 2013-02-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-11-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2013-11-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101331573-B1 |
| titleOfInvention | Resin composition which has photocurability and thermosetting, and dry film soldering resist |
| abstract | The present invention relates to resin compositions and dry film solder resists having photocurable and thermoset properties that enable the provision of dry film solder resists having higher glass transition temperatures and improved heat resistance reliability. The resin composition may be an acid-modified oligomer comprising a carboxyl group (-COOH) and an iminocarbonate compound having a photocurable unsaturated functional group; Photopolymerizable monomers having three or more photocurable unsaturated functional groups; Thermosetting binders having thermosetting functional groups; And photoinitiators. |
| priorityDate | 2012-02-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 253.