abstract |
The present invention is an epoxy resin composition mainly composed of an epoxy resin, a curing agent and an inorganic filler, wherein the epoxy resin comprises an epoxy resin of the formula. Therefore, heat conductivity can be improved using the epoxy resin containing the mesogenic structure which raises crystallinity. In addition, it is possible to provide a high heat-radiating substrate by using the epoxy resin in a printed circuit board as an insulating material. |