| abstract |
The present invention relates to a film- or paste-type low stress conductive adhesive composition comprising: a) at least one acrylic copolymer or terpolymer having a functional group; b) an epoxy resin; And c) a conductive filler. In addition, additional components such as adhesion promoters and conductivity enhancers may be further added to the conductive adhesive composition of the present invention. When the film type or paste type conductive adhesive of the present invention is used, the adhesive strength can be improved as compared with the film adhesive having the flexibility of the conventional conductive adhesive, and the component bonded compared to the existing conductive film having a high adhesive strength. The stress between them can be further reduced.n n n Conductive adhesive, acrylic, epoxy resin, conductive filler, adhesive strength, stress |