http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101322582-B1
Outgoing Links
Predicate | Object |
---|---|
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-012 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-80 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-6407 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-348 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-035 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-031 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D175-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-73 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-031 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
filingDate | 2010-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2013-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2013-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | KR-101322582-B1 |
titleOfInvention | Photosensitive resin composition, its dry film, and printed wiring board using them |
abstract | The alkali developable photosensitive resin composition contains the carboxyl group-containing urethane resin, photoinitiator, aluminum hydroxide, and / or phosphorus containing compound which have a biphenyl novolak structure. In addition to each component described above, by further containing a thermosetting component having a plurality of cyclic ether groups and / or cyclic thioether groups in the molecule, it can be made into a photocurable thermosetting resin composition, and may further contain a colorant. By using the photosensitive resin composition or the dry film thereof, a non-halogen composition has a low environmental load, flame retardancy, low warpage, and a flame retardant cured film such as solder resist having excellent properties such as bendability, solder heat resistance, and gold plating resistance, is formed. A printed wiring board can be provided. |
priorityDate | 2009-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 647.