| abstract |
The present invention relates to a method for forming a pattern that improves the surface characteristics of a patterned substrate and a mold in contact with the surface. The method includes loading a substrate coated with a pattern forming material into a chamber, and forming a pattern having irregularities on a surface thereof. Opposing the provided soft mold to the upper portion of the substrate in the chamber, vaporizing a portion of the pattern forming material and adsorbing it on the surface of the soft mold to form an adsorption layer, soft including the adsorption layer And contacting the mold with the remaining pattern forming material to form a pattern layer in a reverse phase of the irregularities of the surface of the soft mold, and separating the soft mold from the pattern layer.n n n n Printing plate, soft mold, hydrophobic, hydrophilic, stamping |