| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-2982
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02E60-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02E60-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29B2009-125
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01M4-133
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01B2210-0046
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2361-06 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G11-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G11-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G8-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01B21-0461
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01J20-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01J20-28004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G11-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29B9-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B01J20-3078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01B13-0266
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J3-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01M4-587 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G11-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G11-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G8-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G11-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C01B32-336
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J161-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-04 |
| filingDate |
2007-10-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2013-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2013-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-101311038-B1 |
| titleOfInvention |
Non-heat-melt granular phenolic resin and its manufacturing method, and thermosetting resin composition, semiconductor sealing material and semiconductor adhesive |
| abstract |
A non-heat-melt granular phenolic resin having an average particle diameter of 20 µm or less, a single particle ratio of 0.7 or more, and preferably a chlorine content of 500 ppm or less is provided. Such non-heat-melt granular phenolic resins of the present invention are useful as organic fillers such as semiconductor sealing materials and semiconductor adhesives, or as precursors of functional carbon materials such as molecular sieve carbon and carbon electrode materials. |
| priorityDate |
2006-10-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |