http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101310407-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0045 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0045 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 |
| filingDate | 2009-04-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-09-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2013-09-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101310407-B1 |
| titleOfInvention | Formation method of the photosensitive resin composition, the photosensitive element, the resist pattern, and the manufacturing method of a printed wiring board |
| abstract | (A) a binder polymer, (B) a photopolymerizable compound having an ethylenically unsaturated bond in a molecule, (C) a photopolymerization initiator, and (D) a polymerization inhibitor, wherein the content of the (D) polymerization inhibitor The photosensitive resin composition which is 20-100 ppm by weight based on the total solid content. |
| priorityDate | 2008-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 167.