| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01015
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-13091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-45
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48465
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45015
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32245
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1461
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-8592 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-0203
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14632
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14621
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14627
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14618
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-12 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-065 |
| filingDate |
2010-02-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2013-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2013-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-101301646-B1 |
| titleOfInvention |
Image and Light Sensor Chip Packages |
| abstract |
The image or light sensor chip package includes an image or light sensor chip having a non-photosensitive region and a photosensitive region surrounded by the non-photosensitive region. In the photosensitive region, optical sensors, a layer of an optical or color filter array above the optical sensors and microlenses on a layer of the optical or color filter array are located. In the non-photosensitive region, an adhesive polymer layer and a plurality of metal structures having portions in the adhesive polymer layer are located. A transparent substrate is formed on the top surface of the adhesive polymer and on the microlenses. The image or optical sensor chip package also includes a wire bonding wires or a flexible substrate bonded with the metal structures of the image or optical sensor chip. |
| priorityDate |
2009-02-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |