| abstract |
[Problem] Even if it is bent, it can be handled without cracking or peeling, the bump electrode can be laminated on the electrode side of the semiconductor wafer on which the narrow pitch and the high pin number bump electrode are formed during the lamination, Provided is a semiconductor adhesive composition which can be cut at high speed without contamination or defects, and is easy to recognize alignment marks during dicing and flip chip mounting.n n n [Solution] Containing (a) organic solvent soluble polyimide, (b) epoxy compound and (c) curing accelerator, and (b) organic solvent soluble polyimide with respect to 100 parts by weight of (b) epoxy compound. 90 parts by weight, (c) a curing accelerator and 0.1 to 10 parts by weight containing, and, (b) an epoxy compound is 25 ℃, 1.013 × 10 5 N / ㎡ liquefied compound with 25 ℃ in, 1.013 × 10 5 N / ㎡ It is an adhesive composition for semiconductors containing a compound which is solid in the ratio, and the ratio of the liquid compound in all the epoxy compounds is 20 weight% or more and 60 weight% or less.n n n Adhesive composition for semiconductors, Semiconductor device |