http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101288703-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-315 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-4014 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-315 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate | 2006-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-07-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2013-07-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101288703-B1 |
| titleOfInvention | Epoxy resin composition for semiconductor encapsulation and semiconductor device |
| abstract | Epoxy resin composition excellent in flame retardancy, soldering crack resistance, and fluidity, having a low warpage after molding or soldering in an area-mounted semiconductor device, and a low warpage at low temperature such as a temperature cycle test, and a semiconductor device using the same. to provide. The epoxy resin composition used for the semiconductor device includes at least one epoxy resin (A) selected from trifunctional epoxy resin and tetrafunctional epoxy resin, a curing agent (B) having at least two hydroxyl groups in one molecule, and at least two in one molecule. The compound (C) which has two cyanate groups, and an inorganic filler (D) are contained as an essential component. |
| priorityDate | 2005-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 156.