http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101284943-B1
Outgoing Links
Predicate | Object |
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classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C33-3842 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0017 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B82Y40-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B82Y10-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C33-3857 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-2012 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C33-40 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G09F9-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G09F9-00 |
filingDate | 2006-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2013-07-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2013-07-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | KR-101284943-B1 |
titleOfInvention | Mold manufacturing method |
abstract | The present invention relates to a method of forming a mold, comprising: forming a resin layer by applying a resin having photocuring properties between a master substrate having a first pattern and a transparent mold substrate, and forming the resin layer through the transparent mold substrate. Curing the surface by first irradiating with ultraviolet light, and separating the master layer from the resin layer having the surface cured in a state in which it is bonded with the mold substrate, thereby forming a second pattern having a groove shape in which the first pattern is transferred. And forming a mold having surface properties that can be selected from either hydrophobic or hydrophilic. Therefore, since the resin having a photocuring property is first irradiated with ultraviolet light to harden the surface, and then irradiated with a second light to completely cure the inside, the mold can be prevented from being deformed even when the organic solvent is volatilized. Since the surface energy of the mold can be adjusted by the first and second irradiations, the surface characteristics of the mold can be easily selected.n n n n Non-exposure method, photoresist pattern, mold, surface energy, photocurable resin, curing |
priorityDate | 2006-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 37.