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filingDate 2010-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2013-07-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2013-07-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-101282706-B1
titleOfInvention Polyamide composition with excellent surface reflectance and heat resistance
abstract The polyamide resin composition of the present invention is a polyamide resin composition comprising 30 to 80% by weight of polyamide resin (A), 10 to 60% by weight of inorganic filler (B), and 10 to 50% by weight of white pigment (C). 0.05 to 2 parts by weight of a light stabilizer (D) based on 100 parts by weight of the polyamide resin (A); And inorganic fine particles (E) is characterized in that it further comprises 0.05 to 3 parts by weight. The polyamide resin composition and the molded article obtained by processing the same have excellent surface reflectivity and heat resistance, and have high mechanical strength, and thus are used as materials suitable for LED manufacturing processes and reflow soldering processes, and reflecting plates or reflecting plates of LED driving devices. Can be used as
priorityDate 2010-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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