| abstract |
Described herein are methods and apparatus for removing metal oxides and / or forming solder joints on at least some substrate surfaces within a target area. In one particular embodiment, such a method and apparatus is for reducing a metal oxide in a substrate comprising a layer having a plurality of solder bumps to form a solder joint, which provides one or more energizing electrodes and provides the energizing electrodes to the energizing electrodes. By exposing at least a portion of such layers and solder bumpers. |