| abstract |
Provides a bonding structure of a bonding wire and a method of forming the same, which solve the problems of the prior art in practical use of a multilayer copper bonding wire, improve the formation and bonding properties of the ball portion, increase the bonding strength of the wedge connection, and also provide excellent industrial productivity. . The bonding wire had copper as a main component, and formed the thickening layer with the high density | concentration of electroconductive metals other than copper in the said ball joint part. A concentrated layer was formed in the vicinity of the surface of the ball joint or at the interface of the ball joint. It is preferable that the thickness of the region where the concentration of the conductive metal is 0.05 to 20 mol% is 0.1 µm or more, and the concentration of the conductive metal in the thickening layer is at least 5 times the average concentration of the conductive metal in the ball joints other than the thickening layer. .n n n Multi-layer copper bonding wire, conductive metal thickening layer, interface thickening layer, surface thickening layer |