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filingDate 2010-01-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2013-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2013-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-101279495-B1
titleOfInvention Method of manufacturing the photoelectric conversion device, the method of using the photoelectric conversion device, the production system of the photoelectric conversion device and the photoelectric conversion device manufacturing system
abstract In the method of manufacturing this photoelectric conversion device, the photoelectric conversion device 10 in which the first photoelectric conversion unit 3 and the second photoelectric conversion unit 4 are sequentially stacked on the transparent conductive film 2 formed on the substrate 1 is provided. As a manufacturing method of the method, the first p-type semiconductor layer 31, the first i-type semiconductor layer 32, the first n-type semiconductor layer (in the plurality of first plasma CVD reaction chambers 62, 63, 64, 65) 33) and a second plasma before forming the second i-type semiconductor layer 42 by forming each of the second p-type semiconductor layer 41 and exposing the second p-type semiconductor layer 41 to an atmospheric atmosphere. A gas containing a p-type impurity is supplied into the CVD reaction chamber 72, and the second i-type semiconductor is disposed on the second p-type semiconductor layer 41 exposed to the atmosphere in the second plasma CVD reaction chamber 72. A layer 42 is formed, and a second n-type semiconductor layer 43 is formed on the second i-type semiconductor layer 42.
priorityDate 2009-01-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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