http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101278991-B1

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filingDate 2006-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2013-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2013-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-101278991-B1
titleOfInvention Anisotropic Conductive Adhesive
abstract When the epoxy resin, the phenoxy resin, the curing agent, the inorganic filler, and the conductive particles are included as components, and the glass transition temperature (Tg) of the phenoxy resin is 66 ° C or more and 100 ° C or less, the flow characteristics at the time of mounting are excellent. The present invention provides an anisotropic conductive adhesive for use in applications that have good conductivity / insulation performance and adhesion performance, and have a small change in properties even when used for a long time under high temperature and high humidity conditions, and require high reliability.n n n Anisotropic conductivity, phenoxy resin, glass transition temperature
priorityDate 2005-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 42.