| abstract |
The anisotropic conductive adhesive conductive particles are dispersed in an epoxy adhesive containing an epoxy compound and the curing agent is the elastic modulus at each of those of the cured product 35 ℃, 55 ℃, 95 ℃ and 150 ℃ EM 35, EM 55, EM 95 and EM the elastic modulus change rate between the 150 and, 55 ℃ and ΔEM the modulus change rate between 95 ℃ 55 -95, 95 ℃ and 150 ℃ ΔEM 95 - when hayeoteul 150, satisfies expression (1) to (5). |