| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0271
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09718
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09518
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0175
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0187
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0133
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0231
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10734
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0179
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-113
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4602
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-096
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09563
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10522
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09509
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09763 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-162
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-46 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-16 |
| filingDate |
2004-12-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2013-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2013-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-101269318-B1 |
| titleOfInvention |
Multilayer printed wiring board |
| abstract |
The multilayer printed wiring board 10 includes a mounting unit 60 in which a semiconductor element electrically connected to the wiring pattern 32 or the like is mounted on the uppermost surface; And a condenser portion 40 having a high dielectric constant layer 43 formed of ceramic and a first layer electrode and second layer electrodes 41 and 42 sandwiching the high dielectric constant layer 43. One of the first and second layer electrodes 41 and 42 is connected to the power line of the semiconductor element, and the other of the first and second layer electrodes 41 and 42 is connected to the ground line. do. In this multilayer printed wiring board 10, the high dielectric constant layer 43 contained in the layer capacitor part 40 connected between a power supply line and a ground line is formed of ceramic. In this structure, the capacitance of the layered cone sensor portion 40 can be large, and exhibits a sufficient decoupling effect even in an environment in which instantaneous potential drop easily occurs. |
| priorityDate |
2003-12-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |