http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101267828-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-302 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-312 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J175-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-284 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-401 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-38 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J175-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
| filingDate | 2011-07-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2013-05-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101267828-B1 |
| titleOfInvention | Adhesive composition for protective film and flexible circuit board protective film using same |
| abstract | In the present invention, containing an acrylic resin having an hydroxy functional group and an isocyanate curing agent, 6 to 15 parts by weight of a mixture of toluene diisocyanate (TDI) and hexamethylene diisocyanate (HDI) based curing agent based on 100 parts by weight of the acrylic resin, It provides an adhesive composition for a flexible circuit board protective film and a flexible circuit board protective film using the same, characterized in that it comprises 0.1 to 10 parts by weight of a plasticizer having an ester value of 100 or more. Flexible circuit board protective film according to the present invention can effectively control the adhesion and high-speed peeling properties after the initial and high temperature compression to prevent the surface contamination and deformation of the flexible circuit board as the adherend. In addition, it minimizes surface contamination caused by etching liquid penetration and high temperature compression process during the circuit printing process of the flexible circuit board, thereby preventing adhesive transfer to the flexible product after peeling and damage to the product. Workability can be improved. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20150016720-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015072794-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102183505-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101687077-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20150056492-A |
| priorityDate | 2011-07-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 86.