http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101261745-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1464 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14636 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5226 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14689 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate | 2011-10-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2013-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101261745-B1 |
| titleOfInvention | Semiconductor device having bonding pads and method for manufacturing same |
| abstract | The semiconductor device includes a device substrate having a front side and a back side. The semiconductor device also includes an interconnect structure disposed on the front side of the device substrate and having n metal layers. The semiconductor device also includes a bonding pad disposed on the back side of the device substrate and in direct contact with the nth metal layer of the n metal layers through the interconnect structure. |
| priorityDate | 2011-05-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 21.