http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101258100-B1

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filingDate 2004-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2013-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2013-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-101258100-B1
titleOfInvention Selective barrier metal polishing solution
abstract Polishing solutions are useful for removing barrier material in the presence of interconnect metals and dielectrics. The polishing solution is used to reduce the removal rate of at least one pH adjuster, interconnect metal to adjust the pH level of the polishing solution selected from the group consisting of 0.1 to 10% by weight of hydrogen peroxide, nitric acid, sulfuric acid, hydrochloric acid and phosphoric acid to less than 3 At least 0.0025% by weight of a benzotriazole inhibitor, 0-10% by weight of surfactant, 0.01-10% by weight of colloidal silica with an average particle size of less than 50 nm and residual water and incidental impurities. The polishing solution has at least three to one tantalum nitride material to copper selectivity and at least three to one tantalum nitride nitride to TEOS selectivity.
priorityDate 2003-01-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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