http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101247890-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14 |
| filingDate | 2009-09-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2013-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101247890-B1 |
| titleOfInvention | Barrier Slurry for Low-k dielectric |
| abstract | The present invention provides a chemical-mechanical polishing composition for polishing a substrate. The polishing composition is silica; Compounds selected from the group consisting of amine-substituted silanes, tetraalkylammonium salts, tetraalkylphosphonium salts, and imidazolium salts; Carboxylic acids having 7 or more carbon atoms; Oxidizing agents for oxidizing metals; And water. The present invention also provides a method for chemically-mechanically polishing a substrate by the polishing composition. |
| priorityDate | 2008-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 169.