| abstract |
The method for manufacturing flat-top pads in electronic componentsn n n a) stencil printing a flat-top attachment of the curable silicone composition to a first electronic substrate, wherein the first electronic substrate is selected from a semiconductor die and a semiconductor die attach member, and the stencil printing of the flat-top attachment is down-step By squeegee through a stencil)n n n b) curing the flat-top attachment to form a flat-top pad,n n n Optionally c) attaching a second electronic substrate to the top of the flat-top pad, wherein the second electronic substrate is selected from a semiconductor die and a semiconductor die attach member; andn n n Optionally, d) repeating steps (a), (b) and (c).n n n n Flat-top pads, electronic components, curable silicone compositions, electronic substrates, down-step stencils, stencil printing, semiconductor dies, die attach adhesives. |