| abstract |
The present invention discloses a multilayer wiring connection structure and a method of manufacturing the same, which can improve productivity. The multilayer wiring connection structure of the present invention includes a substrate, a first wiring formed on the substrate, an interlayer insulating film formed on the first wiring, a second wiring formed on the interlayer insulating film, the second wiring and the first wiring. The via contact may include a via contact having at least one conductive filament electrically connected to the first wiring and the second wiring through the interlayer insulating film between the first wirings.n n n n Via, Contact, Line, Interlayer Insulation, Contact |