http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101243646-B1
Outgoing Links
Predicate | Object |
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classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02126 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76817 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02118 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76811 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76802 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31144 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02216 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76819 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76838 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0274 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02282 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-302 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76885 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3086 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-302 |
filingDate | 2005-09-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2013-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2013-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | KR-101243646-B1 |
titleOfInvention | How to form in-situ groove structure |
abstract | The present invention features a method of forming a pattern on a substrate comprising forming a multi-layer film having a surface, an etch-rate interface, and an etch-differential interface on the substrate. An etch-differential interface is defined between the etch-rate interface and the surface. The recorded pattern is transferred onto a substrate that is partially defined by an etch-differential interface. The recorded pattern has an etched pattern feature (EPC) that defines the pattern shape formed in a given etch process or a set of etch processes. The etch-differential interface deforms the EPC. By establishing a suitable etch-differential interface, a recorded pattern that is substantially different in shape compared to the shape of the patterned layer may be obtained, or the same pattern may be obtained.n n n n Substrate, Etch, Imprint, Lithography, Pattern, Micro-fabrication, Relief Structure |
priorityDate | 2004-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 39.