http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101235385-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-045 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-04 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-07 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-04 |
| filingDate | 2006-05-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-02-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2013-02-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101235385-B1 |
| titleOfInvention | Thermally conductive silicone composition |
| abstract | The present invention provides a thermally conductive silicone composition having good handleability and moldability and good physical properties after curing, even when the thermally conductive filler is highly charged to obtain a high thermally conductive silicone composition.n n n The thermally conductive silicone compositionn n n (A) organopolysiloxane represented by the following formula (1)n n n ≪ Formula 1 >n n n {(CH 2 = CH) R 1 2 SiO 1/2} L (R 1 SiO 3/2) m (R 1 2 SiO) n {O 1/2 SiR 1 2 -R 2 -SiR 1 (3-a ) (OR 3 ) a } o (1)n n n (Wherein R 1 is a homogeneous or heterogeneous monovalent hydrocarbon group, R 2 is an oxygen atom or a divalent hydrocarbon group, R 3 is an alkyl group, an alkoxyalkyl group, an alkenyl group, or an acyl group, L and o are 1 to 10 Positive number, m is a number from 0 to 10, n is a number from 5 to 100, a is an integer from 1 to 3, provided that when m = 0, L + o = 2, R 2 is a divalent hydrocarbon group),n n n (B) a thermally conductive filler, andn n n (C) organopolysiloxane except component (A)n n n .n n n Thermally Conductive Silicone Compositions, Organopolysiloxanes, Thermally Conductive Fillers |
| priorityDate | 2005-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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