http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101233751-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06551 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06575 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-24145 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06579 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3011 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06555 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06524 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06527 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-0652 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49575 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0657 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-02 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-495 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-02 |
| filingDate | 2005-04-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2013-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101233751-B1 |
| titleOfInvention | Microfeed Stack Die Component Assembly |
| abstract | The present invention provides an apparatus for vertically interconnecting a semiconductor die, an integrated circuit die, or multiple die segments. One or more die or segment sides may optionally be added to the die or multi-die segment to provide an edge adhesive pad at the die surface for external electrical connection points.n n n After the metal rerouting interconnect is added to the die of the wafer, the wafer is optionally thinned and each die or multiple die segments are made into a single die from the wafer by cutting or other suitable fragmentation operation. After the die or multiple die segments are cut or unified from the wafer, insulation is applied to all surfaces of the die or multiple die segments, an opening is made over the desired electrical connection location pads, and the die or multiple die segments are Placed on top of each other to form a stack.n n n Vertically adjacent segments in the stack are electrically interconnected by attaching a short flexible adhesive wire or adhesive ribbon to an electrically connected location pad exposed at the peripheral edge of the die, wherein the peripheral edges of the die protrude horizontally from the die. And connect electrically conductive polymers, or epoxy filaments or lines, to one or more of the stack sides. |
| priorityDate | 2004-04-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 31.