| abstract |
An under-bump metallization (UBM) structure is provided for substrates such as organic substrates, ceramic substrates, silicon or glass interposers, high-density interconnects, printed circuit boards, or the like. A buffer layer is formed over the contact pads over the substrate such that at least a portion of the contact pads are exposed. Conductor pads are formed in the openings and extend over at least a portion of the buffer layer. The conductor pads may have a uniform thickness and / or a non-planar surface. The substrate may be attached to another substrate and / or die. |