| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-611
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-617 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 |
| filingDate |
2010-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2013-01-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2013-01-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-101221376-B1 |
| titleOfInvention |
Copper Plating Method |
| abstract |
The present invention relates to a copper electroplating method, comprising: preparing a copper plating solution composition containing 10 to 50 mL / L of crosslinked polyamide as a flattener; It includes; electroplating at room temperature, atmospheric pressure using the copper plating solution composition; In the case of using the copper plating method according to the present invention, plating can be performed without any empty space even at a fine line width of 100 nm or less. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10917966-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20220039539-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11699740-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10932371-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102495812-B1 |
| priorityDate |
2010-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |