abstract |
The flux for solder paste which concerns on this invention contains resin, a plasticizer, a solvent, and an activator. The plasticizer is dibutylphthalate (DBP), benzylbutylphthalate (benzylbutylphthalate, BBP), dioctylphthalate (DOP), dioctyl sebacate (DOS) and dioctyl azelate (dioctyl azelate, DOZ At least one material selected from the group consisting of. |