http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101207775-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-016 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K9-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-22 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K9-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-22 |
| filingDate | 2005-06-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2012-12-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2012-12-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101207775-B1 |
| titleOfInvention | High thermal conductivity materials arranged in resins |
| abstract | In one embodiment, the present invention provides a high thermal conductivity resin comprising a host resin matrix 32 and a high thermal conductivity filler 30. The high thermal conductivity fillers form a continuous organic-inorganic mixture with the host resin matrix, and the fillers have an aspect ratio between 3-100. The fillers are distributed almost uniformly over the host resin matrix and are arranged in essentially the same direction. In some embodiments, the resins are highly structured resin types. |
| priorityDate | 2004-06-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 47.