| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K71-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K85-6565
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02E10-549
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K85-611
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K85-649
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K59-17
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K85-1135
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K85-114 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K71-231
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05B33-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K10-00 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L51-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L51-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-32 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05B33-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L51-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L51-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L51-30 |
| filingDate |
2004-07-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2012-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2012-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-101207073-B1 |
| titleOfInvention |
Method for removing organic layer during fabrication of organic electronic device and organic electronic device formed by these methods |
| abstract |
The present invention includes the steps of (a) forming a first conductive member and a conductive lead spaced apart from each other on a substrate; (b) forming an organic layer on the substrate, the first conductive member and the conductive lead; (c) forming a patterned conductive layer on the organic layer, the patterned conductive layer comprising a second conductive member and making exposed and unexposed portions to the organic layer; And (d) dry etching at least an exposed portion of the organic layer at a pressure in the range of about 0.01 to 7.5 mTorr using one or more oxygen-containing gases to expose a portion of the conductive lead. It is about.n n n n Dry etching, organic electronic device, conductive member, conductive lead, organic layer |
| priorityDate |
2003-07-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |