| abstract |
A release layer is formed on the substrate, at least one thin film integrated circuit is formed on the release layer, a film is formed on each of the at least one thin film integrated circuit, and the release layer is removed using an etchant. Thus, at least one thin film integrated circuit is stripped from the substrate. The semiconductor device is formed by sealing the peeled thin film integrated circuit by lamination or the like.n n n n Stripping, Thin Film Integrated Circuit, Semiconductor, Etching |