http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101195266-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10253 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-49113 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01322 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0657 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 |
| filingDate | 2010-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2012-11-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2012-11-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101195266-B1 |
| titleOfInvention | Semiconductor package and chip selection method |
| abstract | The semiconductor package of the present invention includes a first semiconductor chip having a first through electrode formed thereon, a second semiconductor chip stacked on the first semiconductor chip and having a second through electrode formed thereon, and formed on the first semiconductor chip. And a cantilever electrically connected to the first through electrode or the second through electrode according to an electrical signal. |
| priorityDate | 2010-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 47.