http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101189646-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-124 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D175-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D175-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-285 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L75-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-672 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G18-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L75-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
| filingDate | 2005-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2012-10-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2012-10-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-101189646-B1 |
| titleOfInvention | Thermosetting Urethane Resin Composition |
| abstract | The present invention provides a thermosetting resin composition containing a polyurethane (A) having two or more carboxyl groups in one molecule, in particular a polyurethane having one or more carboxyl groups at its molecular end and a thermosetting composition (B), a cured product thereof, and a cured product thereof. A soldering resist and a protective film which consist of these, and the printed wiring board coat | covered with the hardened | cured material are provided. The polyurethane (A) preferably has a number average molecular weight of 500 to 100,000 and an acid value of 5 to 150 mgKOH / g. The thermosetting component (B) is preferably an epoxy resin. The thermosetting resin composition of this invention is excellent in adhesiveness with a board | substrate, low bending property, flexibility, moisture heat resistance, soldering heat resistance, and tin plating resistance. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102464129-B1 |
| priorityDate | 2004-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 123.